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BibTeX record conf/irps/HamidOBBCA22
@inproceedings{DBLP:conf/irps/HamidOBBCA22, author = {M. Hamid and K. O'Connell and J. Bielick and J. Bennett and E. Campbell and A. Alfoqaha}, title = {Numerical Simulation and Characterization of {PCB} Warpage}, booktitle = {{IEEE} International Reliability Physics Symposium, {IRPS} 2022, Dallas, TX, USA, March 27-31, 2022}, pages = {16--1}, publisher = {{IEEE}}, year = {2022}, url = {https://doi.org/10.1109/IRPS48227.2022.9764416}, doi = {10.1109/IRPS48227.2022.9764416}, timestamp = {Mon, 09 May 2022 18:11:24 +0200}, biburl = {https://dblp.org/rec/conf/irps/HamidOBBCA22.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
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