BibTeX record conf/irps/ChoiCCZFSYOZFJ18

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@inproceedings{DBLP:conf/irps/ChoiCCZFSYOZFJ18,
  author       = {Seungman Choi and
                  Cathryn Christiansen and
                  Linjun Cao and
                  James Zhang and
                  Ronald Filippi and
                  Tian Shen and
                  Kong Boon Yeap and
                  Sean P. Ogden and
                  Haojun Zhang and
                  Bianzhu Fu and
                  Patrick Justison},
  title        = {Effect of metal line width on electromigration of {BEOL} Cu interconnects},
  booktitle    = {{IEEE} International Reliability Physics Symposium, {IRPS} 2018, Burlingame,
                  CA, USA, March 11-15, 2018},
  pages        = {4},
  publisher    = {{IEEE}},
  year         = {2018},
  url          = {https://doi.org/10.1109/IRPS.2018.8353600},
  doi          = {10.1109/IRPS.2018.8353600},
  timestamp    = {Wed, 16 Oct 2019 14:14:55 +0200},
  biburl       = {https://dblp.org/rec/conf/irps/ChoiCCZFSYOZFJ18.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}