BibTeX record conf/imw2/SpessotSERXBLCB22

• > Home > conf/imw2/SpessotSERXBLCB22

@inproceedings{DBLP:conf/imw2/SpessotSERXBLCB22,
  author       = {Alessio Spessot and
                  Shairfe Muhammad Salahuddin and
                  Ricardo Escobar and
                  Romain Ritzenthaler and
                  Yang Xiang and
                  Rahul Budhwani and
                  Eugenio Dentoni Litta and
                  Elena Capogreco and
                  Joao Bastos and
                  Yangyin Chen and
                  Naoto Horiguchi},
  title        = {Thermally stable, packaged aware {LV} {HKMG} platforms benchmark to
                  enable low power {I/O} for next 3D {NAND} generations},
  booktitle    = {{IEEE} International Memory Workshop, {IMW} 2022, Dresden, Germany,
                  May 15-18, 2022},
  pages        = {1--4},
  publisher    = {{IEEE}},
  year         = {2022},
  url          = {https://doi.org/10.1109/IMW52921.2022.9779308},
  doi          = {10.1109/IMW52921.2022.9779308},
  timestamp    = {Fri, 16 Jun 2023 10:04:07 +0200},
  biburl       = {https://dblp.org/rec/conf/imw2/SpessotSERXBLCB22.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}