BibTeX record conf/imw2/HuangSHZLWLXYYC23

• > Home > conf/imw2/HuangSHZLWLXYYC23

@inproceedings{DBLP:conf/imw2/HuangSHZLWLXYYC23,
  author       = {Meng Huang and
                  Shufang Si and
                  Zheng He and
                  Ying Zhou and
                  Sijia Li and
                  Hong Wang and
                  Jinying Liu and
                  Dongsheng Xie and
                  Mengmeng Yang and
                  Kang You and
                  Chris Choi and
                  Yi Tang and
                  Xiaojie Li and
                  Shibing Qian and
                  Xiaodong Yang and
                  Long Hou and
                  Weiping Bai and
                  Zhongming Liu and
                  Yanzhe Tang and
                  Qiong Wu and
                  Yanqin Wang and
                  Tao Dou and
                  Jake Kim and
                  Guilei Wang and
                  Jie Baisp and
                  Adachi Takao and
                  Chao Zhao and
                  Abraham Yoo},
  title        = {A 3D Stackable 1T1C {DRAM:} Architecture, Process Integration and
                  Circuit Simulation},
  booktitle    = {{IEEE} International Memory Workshop, {IMW} 2023, Monterey, CA, USA,
                  May 21-24, 2023},
  pages        = {1--4},
  publisher    = {{IEEE}},
  year         = {2023},
  url          = {https://doi.org/10.1109/IMW56887.2023.10145931},
  doi          = {10.1109/IMW56887.2023.10145931},
  timestamp    = {Sat, 30 Sep 2023 09:48:44 +0200},
  biburl       = {https://dblp.org/rec/conf/imw2/HuangSHZLWLXYYC23.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}