BibTeX record conf/ieeesensors/Rad23

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@inproceedings{DBLP:conf/ieeesensors/Rad23,
  author       = {Ashkan Rad},
  title        = {Low-Bow Glass-Si Anodic Wafer Bonding at High Temperature by Means
                  of {CTE} Engineering of Corning Novel Fusion Glass},
  booktitle    = {2023 {IEEE} SENSORS, Vienna, Austria, October 29 - Nov. 1, 2023},
  pages        = {1--4},
  publisher    = {{IEEE}},
  year         = {2023},
  url          = {https://doi.org/10.1109/SENSORS56945.2023.10324950},
  doi          = {10.1109/SENSORS56945.2023.10324950},
  timestamp    = {Thu, 14 Dec 2023 11:20:49 +0100},
  biburl       = {https://dblp.org/rec/conf/ieeesensors/Rad23.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

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