BibTeX record conf/ieeesensors/LatschDCSAGBK23

download as .bib file

@inproceedings{DBLP:conf/ieeesensors/LatschDCSAGBK23,
  author       = {Bastian Latsch and
                  Omar Ben Dali and
                  Romol Chadda and
                  Niklas Sch{\"{a}}fer and
                  Alexander A. Altmann and
                  Martin Grimmer and
                  Philipp Beckerle and
                  Mario Kupnik},
  title        = {Low Creep 3D-Printed Piezoresistive Force Sensor for Structural Integration},
  booktitle    = {2023 {IEEE} SENSORS, Vienna, Austria, October 29 - Nov. 1, 2023},
  pages        = {1--4},
  publisher    = {{IEEE}},
  year         = {2023},
  url          = {https://doi.org/10.1109/SENSORS56945.2023.10325114},
  doi          = {10.1109/SENSORS56945.2023.10325114},
  timestamp    = {Tue, 07 May 2024 20:07:24 +0200},
  biburl       = {https://dblp.org/rec/conf/ieeesensors/LatschDCSAGBK23.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
a service of  Schloss Dagstuhl - Leibniz Center for Informatics

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.