BibTeX record conf/iecon/WangWCLG21

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@inproceedings{DBLP:conf/iecon/WangWCLG21,
  author       = {Zhongxu Wang and
                  Yangang Wang and
                  Lee Coulbeck and
                  Xiang Li and
                  Wei Gong},
  title        = {Substrate Solder Crack Evaluation and Modelling of Power Module under
                  Passive Cycling},
  booktitle    = {{IECON} 2021 - 47th Annual Conference of the {IEEE} Industrial Electronics
                  Society, Toronto, ON, Canada, October 13-16, 2021},
  pages        = {1--6},
  publisher    = {{IEEE}},
  year         = {2021},
  url          = {https://doi.org/10.1109/IECON48115.2021.9589509},
  doi          = {10.1109/IECON48115.2021.9589509},
  timestamp    = {Thu, 13 Jan 2022 15:37:14 +0100},
  biburl       = {https://dblp.org/rec/conf/iecon/WangWCLG21.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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