Stop the war!
Остановите войну!
for scientists:
default search action
BibTeX record conf/iecon/ChenBLWZZTHC22
@inproceedings{DBLP:conf/iecon/ChenBLWZZTHC22, author = {Cong Chen and Libing Bai and Jun Luo and Jiahao Wang and Quan Zhou and Jie Zhang and Lulu Tian and Wei Huang and Yuhua Cheng}, title = {Investigation of Thermal Deformation Characteristics in {IGBT} Modules Under Bonding Wire Cracking Condition}, booktitle = {{IECON} 2022 - 48th Annual Conference of the {IEEE} Industrial Electronics Society, Brussels, Belgium, October 17-20, 2022}, pages = {1--6}, publisher = {{IEEE}}, year = {2022}, url = {https://doi.org/10.1109/IECON49645.2022.9968498}, doi = {10.1109/IECON49645.2022.9968498}, timestamp = {Sat, 30 Sep 2023 09:47:28 +0200}, biburl = {https://dblp.org/rec/conf/iecon/ChenBLWZZTHC22.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
manage site settings
To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.