BibTeX record conf/icm2/OukairaSZL22

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@inproceedings{DBLP:conf/icm2/OukairaSZL22,
  author       = {Aziz Oukaira and
                  Dhaou Said and
                  Jamal Zbitou and
                  Ahmed Lakhssassi},
  title        = {Transient Thermal Analysis of System-in-Package Technology by the
                  Finite Element Method {(FEM)}},
  booktitle    = {International Conference on Microelectronics, {ICM} 2022, Casablanca,
                  Morocco, December 4-7, 2022},
  pages        = {30--33},
  publisher    = {{IEEE}},
  year         = {2022},
  url          = {https://doi.org/10.1109/ICM56065.2022.10005514},
  doi          = {10.1109/ICM56065.2022.10005514},
  timestamp    = {Sat, 30 Sep 2023 09:45:47 +0200},
  biburl       = {https://dblp.org/rec/conf/icm2/OukairaSZL22.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

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