BibTeX record conf/iciis/ReddyN18

download as .bib file

@inproceedings{DBLP:conf/iciis/ReddyN18,
  author       = {B. Subba Reddy and
                  Sounak Nandi},
  title        = {Development of {HMI} based Multi-stresses Aging Facility for Polymeric
                  Insulators},
  booktitle    = {13th {IEEE} International Conference on Industrial and Information
                  Systems, {ICIIS} 2018, Rupnagar, India, December 1-2, 2018},
  pages        = {371--374},
  publisher    = {{IEEE}},
  year         = {2018},
  url          = {https://doi.org/10.1109/ICIINFS.2018.8721413},
  doi          = {10.1109/ICIINFS.2018.8721413},
  timestamp    = {Fri, 13 Aug 2021 09:26:01 +0200},
  biburl       = {https://dblp.org/rec/conf/iciis/ReddyN18.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
a service of  Schloss Dagstuhl - Leibniz Center for Informatics

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.