BibTeX record conf/icicdt/WangGS19

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@inproceedings{DBLP:conf/icicdt/WangGS19,
  author       = {Hui Wang and
                  Ding Gong and
                  Chen Shen},
  title        = {Electro-thermal analysis of {IGBT} module from 3D {CAD} model},
  booktitle    = {International Conference on {IC} Design and Technology, {ICICDT} 2019,
                  Suzhou, China, June 17-19, 2019},
  pages        = {1--5},
  publisher    = {{IEEE}},
  year         = {2019},
  url          = {https://doi.org/10.1109/ICICDT.2019.8790847},
  doi          = {10.1109/ICICDT.2019.8790847},
  timestamp    = {Mon, 09 Aug 2021 14:54:04 +0200},
  biburl       = {https://dblp.org/rec/conf/icicdt/WangGS19.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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