BibTeX record conf/icicdt/SchwarzenbachNB19

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@inproceedings{DBLP:conf/icicdt/SchwarzenbachNB19,
  author       = {Walter Schwarzenbach and
                  Bich{-}Yen Nguyen and
                  Guillaume Besnard},
  title        = {Low Temperature SmartCutTM enables High Density 3D SoC Applications},
  booktitle    = {International Conference on {IC} Design and Technology, {ICICDT} 2019,
                  Suzhou, China, June 17-19, 2019},
  pages        = {1--2},
  publisher    = {{IEEE}},
  year         = {2019},
  url          = {https://doi.org/10.1109/ICICDT.2019.8790947},
  doi          = {10.1109/ICICDT.2019.8790947},
  timestamp    = {Wed, 16 Nov 2022 21:55:12 +0100},
  biburl       = {https://dblp.org/rec/conf/icicdt/SchwarzenbachNB19.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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