BibTeX record conf/icdsp/ChengCWWV18

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@inproceedings{DBLP:conf/icdsp/ChengCWWV18,
  author       = {Fei Cheng and
                  Jiuwen Cao and
                  Jianzhong Wang and
                  Danping Wang and
                  Pierre{-}Paul Vidal},
  title        = {Excavation Devices Recognition with {ELM-AE} based Multi-Feature Learning
                  Algorithm},
  booktitle    = {23rd {IEEE} International Conference on Digital Signal Processing,
                  {DSP} 2018, Shanghai, China, November 19-21, 2018},
  pages        = {1--5},
  publisher    = {{IEEE}},
  year         = {2018},
  url          = {https://doi.org/10.1109/ICDSP.2018.8631812},
  doi          = {10.1109/ICDSP.2018.8631812},
  timestamp    = {Mon, 31 Oct 2022 09:05:23 +0100},
  biburl       = {https://dblp.org/rec/conf/icdsp/ChengCWWV18.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}