Yongxiang Liu Yuchun Ma Eren Kursun Glenn Reinman Jason Cong Fine grain 3D integration for microarchitecture design through cube packing exploration. 259-266 2007 ICCD http://dx.doi.org/10.1109/ICCD.2007.4601911 conf/iccd/2007 db/conf/iccd/iccd2007.html#LiuMKRC07