BibTeX record conf/iccad/WangXLLCHLS23

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@inproceedings{DBLP:conf/iccad/WangXLLCHLS23,
  author       = {Dengfeng Wang and
                  Liukai Xu and
                  Songyuan Liu and
                  Zhi Li and
                  Yiming Chen and
                  Weifeng He and
                  Xueqing Li and
                  Yanan Sun},
  title        = {TL-nvSRAM-CIM: Ultra-High-Density Three-Level ReRAM-Assisted Computing-in-nvSRAM
                  with DC-Power Free Restore and Ternary {MAC} Operations},
  booktitle    = {{IEEE/ACM} International Conference on Computer Aided Design, {ICCAD}
                  2023, San Francisco, CA, USA, October 28 - Nov. 2, 2023},
  pages        = {1--9},
  publisher    = {{IEEE}},
  year         = {2023},
  url          = {https://doi.org/10.1109/ICCAD57390.2023.10323889},
  doi          = {10.1109/ICCAD57390.2023.10323889},
  timestamp    = {Thu, 04 Jan 2024 09:34:16 +0100},
  biburl       = {https://dblp.org/rec/conf/iccad/WangXLLCHLS23.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}