BibTeX record conf/iccad/PathakPPL11

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@inproceedings{DBLP:conf/iccad/PathakPPL11,
  author       = {Mohit Pathak and
                  Jiwoo Pak and
                  David Z. Pan and
                  Sung Kyu Lim},
  editor       = {Joel R. Phillips and
                  Alan J. Hu and
                  Helmut Graeb},
  title        = {Electromigration modeling and full-chip reliability analysis for {BEOL}
                  interconnect in TSV-based 3D ICs},
  booktitle    = {2011 {IEEE/ACM} International Conference on Computer-Aided Design,
                  {ICCAD} 2011, San Jose, California, USA, November 7-10, 2011},
  pages        = {555--562},
  publisher    = {{IEEE} Computer Society},
  year         = {2011},
  url          = {https://doi.org/10.1109/ICCAD.2011.6105385},
  doi          = {10.1109/ICCAD.2011.6105385},
  timestamp    = {Fri, 24 Mar 2023 00:01:53 +0100},
  biburl       = {https://dblp.org/rec/conf/iccad/PathakPPL11.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}