A low-overhead fault tolerance scheme for TSV-based 3D network on chip links.

Igor Loi Subhasish Mitra Thomas H. Lee Shinobu Fujita Luca Benini A low-overhead fault tolerance scheme for TSV-based 3D network on chip links. 598-602 2008 ICCAD http://doi.acm.org/10.1145/1509456.1509589 conf/iccad/2008 db/conf/iccad/iccad2008.html#LoiMLFB08