Design method and test structure to characterize and repair TSV defect induced signal degradation in 3D system.

Minki Cho Chang Liu Dae Hyun Kim Sung Kyu Lim Saibal Mukhopadhyay Design method and test structure to characterize and repair TSV defect induced signal degradation in 3D system. 694-697 2010 ICCAD http://dx.doi.org/10.1109/ICCAD.2010.5654255 conf/iccad/2010 db/conf/iccad/iccad2010.html#ChoLKLM10