BibTeX record conf/iasam/Paul11

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@inproceedings{DBLP:conf/iasam/Paul11,
  author       = {Dev Paul},
  title        = {A closer look at bonding grounding electrodes {(NEC} 2011, article
                  250 requirements)},
  booktitle    = {2011 {IEEE} Industry Applications Society Annual Meeting, Orlando,
                  FL, USA, October 9-13, 2011},
  pages        = {1--7},
  publisher    = {{IEEE}},
  year         = {2011},
  url          = {https://doi.org/10.1109/IAS.2011.6074262},
  doi          = {10.1109/IAS.2011.6074262},
  timestamp    = {Tue, 06 Jul 2021 18:52:44 +0200},
  biburl       = {https://dblp.org/rec/conf/iasam/Paul11.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

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