BibTeX record conf/i2mtc/KongM18

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@inproceedings{DBLP:conf/i2mtc/KongM18,
  author       = {Lay Wai Kong and
                  Osborne A. Martin},
  title        = {Known void size micro-bump, a novel standard of 3D X-ray computed
                  tomography in-line metrology for accuracy assessment and monitoring},
  booktitle    = {{IEEE} International Instrumentation and Measurement Technology Conference,
                  {I2MTC} 2018, Houston, TX, USA, May 14-17, 2018},
  pages        = {1--5},
  publisher    = {{IEEE}},
  year         = {2018},
  url          = {https://doi.org/10.1109/I2MTC.2018.8409573},
  doi          = {10.1109/I2MTC.2018.8409573},
  timestamp    = {Wed, 16 Oct 2019 14:14:57 +0200},
  biburl       = {https://dblp.org/rec/conf/i2mtc/KongM18.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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