BibTeX record conf/emccompo/LimLJKCLK15

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@inproceedings{DBLP:conf/emccompo/LimLJKCLK15,
  author       = {Jaemin Lim and
                  Manho Lee and
                  Daniel H. Jung and
                  Jonghoon J. Kim and
                  Sumin Choi and
                  Hyunsuk Lee and
                  Joungho Kim},
  title        = {Shielding structures for through silicon via {(TSV)} to active circuit
                  noise coupling in 3D {IC}},
  booktitle    = {10th International Workshop on the Electromagnetic Compatibility of
                  Integrated Circuits, {EMC} Compo 2015, Edinburgh, UK, November 10-13,
                  2015},
  pages        = {248--251},
  publisher    = {{IEEE}},
  year         = {2015},
  url          = {https://doi.org/10.1109/EMCCompo.2015.7358366},
  doi          = {10.1109/EMCCOMPO.2015.7358366},
  timestamp    = {Wed, 16 Oct 2019 14:14:57 +0200},
  biburl       = {https://dblp.org/rec/conf/emccompo/LimLJKCLK15.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}