BibTeX record conf/emccompo/JungKKKBC13

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@inproceedings{DBLP:conf/emccompo/JungKKKBC13,
  author       = {Daniel H. Jung and
                  Heegon Kim and
                  Jonghoon J. Kim and
                  Joungho Kim and
                  Hyun{-}Cheol Bae and
                  Kwang{-}Seong Choi},
  title        = {Modeling and analysis of open defect in through silicon via {(TSV)}
                  channel},
  booktitle    = {9th International Workshop on Electromagnetic Compatibility of Integrated
                  Circuits, {EMC} Compo 2013, Nara, Japan, December 15-18, 2013},
  pages        = {163--166},
  publisher    = {{IEEE}},
  year         = {2013},
  url          = {https://doi.org/10.1109/EMCCompo.2013.6735193},
  doi          = {10.1109/EMCCOMPO.2013.6735193},
  timestamp    = {Wed, 16 Oct 2019 14:14:57 +0200},
  biburl       = {https://dblp.org/rec/conf/emccompo/JungKKKBC13.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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