BibTeX record conf/elinfocom/ParkKJCHK23

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@inproceedings{DBLP:conf/elinfocom/ParkKJCHK23,
  author       = {Sujin Park and
                  Yi{-}Gyeong Kim and
                  Young{-}Deuk Jeon and
                  Min{-}Hyung Cho and
                  Jinho Han and
                  Youngsu Kwon},
  title        = {2.5D Large-Scale Interposer Bonding Process Verification using Daisy-Chain
                  for {PIM} Heterogeneous Integration Platform},
  booktitle    = {International Conference on Electronics, Information, and Communication,
                  {ICEIC} 2023, Singapore, February 5-8, 2023},
  pages        = {1--3},
  publisher    = {{IEEE}},
  year         = {2023},
  url          = {https://doi.org/10.1109/ICEIC57457.2023.10049851},
  doi          = {10.1109/ICEIC57457.2023.10049851},
  timestamp    = {Tue, 21 Mar 2023 16:00:01 +0100},
  biburl       = {https://dblp.org/rec/conf/elinfocom/ParkKJCHK23.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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