BibTeX record conf/ecoc/MergetASSHWW21

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@inproceedings{DBLP:conf/ecoc/MergetASSHWW21,
  author       = {Florian Merget and
                  Manuel Ackermann and
                  Bin Shen and
                  Gordon Davis Saunders and
                  Sebastian Haag and
                  Michael Wolz and
                  Jeremy Witzens},
  title        = {Glass Molded Optical Interposers for Wafer Scale Datacom Component
                  Packaging},
  booktitle    = {European Conference on Optical Communication, {ECOC} 2021, Bordeaux,
                  France, September 13-16, 2021},
  pages        = {1--4},
  publisher    = {{IEEE}},
  year         = {2021},
  url          = {https://doi.org/10.1109/ECOC52684.2021.9605906},
  doi          = {10.1109/ECOC52684.2021.9605906},
  timestamp    = {Wed, 31 May 2023 20:36:00 +0200},
  biburl       = {https://dblp.org/rec/conf/ecoc/MergetASSHWW21.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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