BibTeX record conf/ddecs/GerakisALH14

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@inproceedings{DBLP:conf/ddecs/GerakisALH14,
  author       = {Vasileios Gerakis and
                  Christina Avdikou and
                  Alexandros Liolios and
                  Alkis A. Hatzopoulos},
  title        = {Modeling and analysis of cracked through silicon via {(TSV)} interconnections},
  booktitle    = {17th International Symposium on Design and Diagnostics of Electronic
                  Circuits {\&} Systems, {DDECS} 2014, Warsaw, Poland, 23-25 April,
                  2014},
  pages        = {310--313},
  publisher    = {{IEEE} Computer Society},
  year         = {2014},
  url          = {https://doi.org/10.1109/DDECS.2014.6868817},
  doi          = {10.1109/DDECS.2014.6868817},
  timestamp    = {Fri, 24 Mar 2023 00:04:14 +0100},
  biburl       = {https://dblp.org/rec/conf/ddecs/GerakisALH14.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}