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BibTeX record conf/ddecs/GerakisALH14
@inproceedings{DBLP:conf/ddecs/GerakisALH14, author = {Vasileios Gerakis and Christina Avdikou and Alexandros Liolios and Alkis A. Hatzopoulos}, title = {Modeling and analysis of cracked through silicon via {(TSV)} interconnections}, booktitle = {17th International Symposium on Design and Diagnostics of Electronic Circuits {\&} Systems, {DDECS} 2014, Warsaw, Poland, 23-25 April, 2014}, pages = {310--313}, publisher = {{IEEE} Computer Society}, year = {2014}, url = {https://doi.org/10.1109/DDECS.2014.6868817}, doi = {10.1109/DDECS.2014.6868817}, timestamp = {Fri, 24 Mar 2023 00:04:14 +0100}, biburl = {https://dblp.org/rec/conf/ddecs/GerakisALH14.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
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