High-Frequency Mutual Impedance Extraction of VLSI Interconnects In the Presence of a Multi-layer Conducting Substrate.

Navin Srivastava Roberto Suaya Kaustav Banerjee High-Frequency Mutual Impedance Extraction of VLSI Interconnects In the Presence of a Multi-layer Conducting Substrate. 426-431 2008 DATE http://dx.doi.org/10.1109/DATE.2008.4484718 conf/date/2008 db/conf/date/date2008.html#SrivastavaSB08