BibTeX record conf/dac/VannaIampikulZEKAGRL23

download as .bib file

@inproceedings{DBLP:conf/dac/VannaIampikulZEKAGRL23,
  author       = {Pruek Vanna{-}Iampikul and
                  Lingjun Zhu and
                  Serhat Erdogan and
                  Mohanalingam Kathaperumal and
                  Ravi Agarwal and
                  Ram Gupta and
                  Kevin Rinebold and
                  Sung Kyu Lim},
  title        = {Glass Interposer Integration of Logic and Memory Chiplets: {PPA} and
                  Power/Signal Integrity Benefits},
  booktitle    = {60th {ACM/IEEE} Design Automation Conference, {DAC} 2023, San Francisco,
                  CA, USA, July 9-13, 2023},
  pages        = {1--6},
  publisher    = {{IEEE}},
  year         = {2023},
  url          = {https://doi.org/10.1109/DAC56929.2023.10247949},
  doi          = {10.1109/DAC56929.2023.10247949},
  timestamp    = {Sun, 24 Sep 2023 13:31:06 +0200},
  biburl       = {https://dblp.org/rec/conf/dac/VannaIampikulZEKAGRL23.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
a service of  Schloss Dagstuhl - Leibniz Center for Informatics

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.