BibTeX record conf/dac/KimZTSL21

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@inproceedings{DBLP:conf/dac/KimZTSL21,
  author       = {Jinwoo Kim and
                  Lingjun Zhu and
                  Hakki Mert Torun and
                  Madhavan Swaminathan and
                  Sung Kyu Lim},
  title        = {Micro-bumping, Hybrid Bonding, or Monolithic? {A} {PPA} Study for
                  Heterogeneous 3D {IC} Options},
  booktitle    = {58th {ACM/IEEE} Design Automation Conference, {DAC} 2021, San Francisco,
                  CA, USA, December 5-9, 2021},
  pages        = {1189--1194},
  publisher    = {{IEEE}},
  year         = {2021},
  url          = {https://doi.org/10.1109/DAC18074.2021.9586229},
  doi          = {10.1109/DAC18074.2021.9586229},
  timestamp    = {Sun, 02 Oct 2022 15:58:45 +0200},
  biburl       = {https://dblp.org/rec/conf/dac/KimZTSL21.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

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