BibTeX record conf/cicc/LiewSKN23

download as .bib file

@inproceedings{DBLP:conf/cicc/LiewSKN23,
  author       = {Harrison Liew and
                  Farhana Sheikh and
                  David Kehlet and
                  Borivoje Nikolic},
  title        = {Silicon Process Technology Constraints for Standardized Vertical Die-to-Die
                  Interconnects},
  booktitle    = {{IEEE} Custom Integrated Circuits Conference, {CICC} 2023, San Antonio,
                  TX, USA, April 23-26, 2023},
  pages        = {1--6},
  publisher    = {{IEEE}},
  year         = {2023},
  url          = {https://doi.org/10.1109/CICC57935.2023.10121246},
  doi          = {10.1109/CICC57935.2023.10121246},
  timestamp    = {Mon, 05 Feb 2024 20:28:42 +0100},
  biburl       = {https://dblp.org/rec/conf/cicc/LiewSKN23.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.