BibTeX record conf/cicc/KoyanagiFT10

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@inproceedings{DBLP:conf/cicc/KoyanagiFT10,
  author       = {Mitsumasa Koyanagi and
                  Takafumi Fukushima and
                  Tetsu Tanaka},
  editor       = {Jacqueline Snyder and
                  Rakesh Patel and
                  Tom Andre},
  title        = {Three-dimensional integration technology using through-si via based
                  on reconfigured wafer-to-wafer bonding},
  booktitle    = {{IEEE} Custom Integrated Circuits Conference, {CICC} 2010, San Jose,
                  California, USA, 19-22 September, 2010, Proceedings},
  pages        = {1--4},
  publisher    = {{IEEE}},
  year         = {2010},
  url          = {https://doi.org/10.1109/CICC.2010.5617626},
  doi          = {10.1109/CICC.2010.5617626},
  timestamp    = {Fri, 27 Dec 2019 21:28:25 +0100},
  biburl       = {https://dblp.org/rec/conf/cicc/KoyanagiFT10.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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