BibTeX record conf/case/DaiZWW22

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@inproceedings{DBLP:conf/case/DaiZWW22,
  author       = {Jiabin Dai and
                  Jie Zhang and
                  Junliang Wang and
                  Lihui Wu},
  title        = {A Hybrid Wafer Processing Cycle Prediction Model Based on DPC-Relief-F},
  booktitle    = {18th {IEEE} International Conference on Automation Science and Engineering,
                  {CASE} 2022, Mexico City, Mexico, August 20-24, 2022},
  pages        = {34--39},
  publisher    = {{IEEE}},
  year         = {2022},
  url          = {https://doi.org/10.1109/CASE49997.2022.9926610},
  doi          = {10.1109/CASE49997.2022.9926610},
  timestamp    = {Thu, 15 Dec 2022 08:23:04 +0100},
  biburl       = {https://dblp.org/rec/conf/case/DaiZWW22.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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