BibTeX record conf/ats/WangCE13

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@inproceedings{DBLP:conf/ats/WangCE13,
  author       = {Ran Wang and
                  Krishnendu Chakrabarty and
                  Bill Eklow},
  title        = {Post-bond Testing of the Silicon Interposer and Micro-bumps in 2.5D
                  ICs},
  booktitle    = {22nd Asian Test Symposium, {ATS} 2013, Yilan County, Taiwan, November
                  18-21, 2013},
  pages        = {147--152},
  publisher    = {{IEEE} Computer Society},
  year         = {2013},
  url          = {https://doi.org/10.1109/ATS.2013.36},
  doi          = {10.1109/ATS.2013.36},
  timestamp    = {Fri, 24 Mar 2023 00:02:34 +0100},
  biburl       = {https://dblp.org/rec/conf/ats/WangCE13.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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