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BibTeX record conf/asscc/ChiuLTK18
@inproceedings{DBLP:conf/asscc/ChiuLTK18, author = {Po{-}Wei Chiu and Muqing Liu and Qianying Tang and Chris H. Kim}, title = {A 2.1 pJ/bit, 8 Gb/s Ultra-Low Power In-Package Serial Link Featuring a Time-based Front-end and a Digital Equalizer}, booktitle = {{IEEE} Asian Solid-State Circuits Conference, {A-SSCC} 2018, Tainan, Taiwan, November 5-7, 2018}, pages = {187--190}, publisher = {{IEEE}}, year = {2018}, url = {https://doi.org/10.1109/ASSCC.2018.8579267}, doi = {10.1109/ASSCC.2018.8579267}, timestamp = {Wed, 16 Oct 2019 14:14:55 +0200}, biburl = {https://dblp.org/rec/conf/asscc/ChiuLTK18.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
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