BibTeX record conf/asscc/ChiuLTK18

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@inproceedings{DBLP:conf/asscc/ChiuLTK18,
  author       = {Po{-}Wei Chiu and
                  Muqing Liu and
                  Qianying Tang and
                  Chris H. Kim},
  title        = {A 2.1 pJ/bit, 8 Gb/s Ultra-Low Power In-Package Serial Link Featuring
                  a Time-based Front-end and a Digital Equalizer},
  booktitle    = {{IEEE} Asian Solid-State Circuits Conference, {A-SSCC} 2018, Tainan,
                  Taiwan, November 5-7, 2018},
  pages        = {187--190},
  publisher    = {{IEEE}},
  year         = {2018},
  url          = {https://doi.org/10.1109/ASSCC.2018.8579267},
  doi          = {10.1109/ASSCC.2018.8579267},
  timestamp    = {Wed, 16 Oct 2019 14:14:55 +0200},
  biburl       = {https://dblp.org/rec/conf/asscc/ChiuLTK18.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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