Model Based Layout Pattern Dependent Metal Filling Algorithm for Improved Chip Surface Uniformity in the Copper Process.

Subarna Sinha Jianfeng Luo Charles Chiang Model Based Layout Pattern Dependent Metal Filling Algorithm for Improved Chip Surface Uniformity in the Copper Process. 1-6 2007 conf/aspdac/2007 ASP-DAC http://doi.ieeecomputersociety.org/10.1109/ASPDAC.2007.357783 db/conf/aspdac/aspdac2007.html#SinhaLC07