BibTeX record conf/asicon/LiHPMW23

download as .bib file

@inproceedings{DBLP:conf/asicon/LiHPMW23,
  author       = {Xunyu Li and
                  Weiquan Hao and
                  Zijin Pan and
                  Runyu Miao and
                  Albert Z. Wang},
  title        = {Design for {EMI} Immunity and {ESD} Protection for Wearable and Flexible
                  ICs (Invited)},
  booktitle    = {15th {IEEE} International Conference on ASIC, {ASICON} 2023, Nanjing,
                  China, October 24-27, 2023},
  pages        = {1--2},
  publisher    = {{IEEE}},
  year         = {2023},
  url          = {https://doi.org/10.1109/ASICON58565.2023.10396412},
  doi          = {10.1109/ASICON58565.2023.10396412},
  timestamp    = {Fri, 16 Feb 2024 14:02:58 +0100},
  biburl       = {https://dblp.org/rec/conf/asicon/LiHPMW23.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
a service of  Schloss Dagstuhl - Leibniz Center for Informatics