BibTeX record conf/apccas/LiM06a

download as .bib file

@inproceedings{DBLP:conf/apccas/LiM06a,
  author       = {Jing Li and
                  Hiroshi Miyashita},
  title        = {Post-placement Thermal Via Planning for 3D Integrated Circuit},
  booktitle    = {{IEEE} Asia Pacific Conference on Circuits and Systems 2006, {APCCAS}
                  2006, Singapore, 4-7 December 2006},
  pages        = {808--811},
  publisher    = {{IEEE}},
  year         = {2006},
  url          = {https://doi.org/10.1109/APCCAS.2006.342144},
  doi          = {10.1109/APCCAS.2006.342144},
  timestamp    = {Wed, 16 Oct 2019 14:14:50 +0200},
  biburl       = {https://dblp.org/rec/conf/apccas/LiM06a.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
a service of  Schloss Dagstuhl - Leibniz Center for Informatics

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.