BibTeX record conf/3dic/ZhangTZSB14

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@inproceedings{DBLP:conf/3dic/ZhangTZSB14,
  author       = {Chaoqi Zhang and
                  Paragkumar Thadesar and
                  Muneeb Zia and
                  Thomas E. Sarvey and
                  Muhannad S. Bakir},
  title        = {Au-NiW Mechanically Flexible Interconnects (MFIs) and {TSV} integration
                  for 3D interconnects},
  booktitle    = {2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale,
                  Ireland, December 1-3, 2014},
  pages        = {1--4},
  publisher    = {{IEEE}},
  year         = {2014},
  url          = {https://doi.org/10.1109/3DIC.2014.7152166},
  doi          = {10.1109/3DIC.2014.7152166},
  timestamp    = {Tue, 16 Nov 2021 15:34:20 +0100},
  biburl       = {https://dblp.org/rec/conf/3dic/ZhangTZSB14.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

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