BibTeX record conf/3dic/WilliamsOMGR09

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@inproceedings{DBLP:conf/3dic/WilliamsOMGR09,
  author       = {G. Williams and
                  Patrick O'Hara and
                  J. Moore and
                  Bart Gordon and
                  J. Rose},
  title        = {A review of wafer bonding materials and characterizations to enable
                  wafer thinning, backside processing, and laser dicing},
  booktitle    = {{IEEE} International Conference on 3D System Integration, 3DIC 2009,
                  San Francisco, California, USA, 28-30 September 2009},
  pages        = {1},
  publisher    = {{IEEE}},
  year         = {2009},
  url          = {https://doi.org/10.1109/3DIC.2009.5306571},
  doi          = {10.1109/3DIC.2009.5306571},
  timestamp    = {Mon, 11 May 2020 17:47:39 +0200},
  biburl       = {https://dblp.org/rec/conf/3dic/WilliamsOMGR09.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}