BibTeX record conf/3dic/WangHCYKCCCLJTL15

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@inproceedings{DBLP:conf/3dic/WangHCYKCCCLJTL15,
  author       = {Chuei{-}Tang Wang and
                  Jeng{-}Shien Hsieh and
                  Victor C. Y. Chang and
                  En{-}Hsiang Yeh and
                  Feng{-}Wei Kuo and
                  Hsu{-}Hsien Chen and
                  Chih{-}Hua Chen and
                  Huan{-}Neng Ron Chen and
                  Ying{-}Ta Lu and
                  Chewnpu Jou and
                  Hao{-}Yi Tsai and
                  C. S. Liu and
                  Doug C. H. Yu},
  title        = {Power saving and noise reduction of 28nm {CMOS} {RF} system integration
                  using integrated fan-out wafer level packaging (InFO-WLP) technology},
  booktitle    = {2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai,
                  Japan, August 31 - September 2, 2015},
  pages        = {TS6.3.1--TS6.3.4},
  publisher    = {{IEEE}},
  year         = {2015},
  url          = {https://doi.org/10.1109/3DIC.2015.7334573},
  doi          = {10.1109/3DIC.2015.7334573},
  timestamp    = {Wed, 16 Oct 2019 14:14:50 +0200},
  biburl       = {https://dblp.org/rec/conf/3dic/WangHCYKCCCLJTL15.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}