BibTeX record conf/3dic/VosPPOMBKWWU16

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@inproceedings{DBLP:conf/3dic/VosPPOMBKWWU16,
  author       = {Joeri De Vos and
                  Lan Peng and
                  Alain Phommahaxay and
                  Joost Van Ongeval and
                  Andy Miller and
                  Eric Beyne and
                  Florian Kurz and
                  Thomas Wagenleiter and
                  Markus Wimplinger and
                  Thomas Uhrmann},
  title        = {Importance of alignment control during permanent bonding and its impact
                  on via-last alignment for high density 3D interconnects},
  booktitle    = {2016 {IEEE} International 3D Systems Integration Conference, 3DIC
                  2016, San Francisco, CA, USA, November 8-11, 2016},
  pages        = {1--5},
  publisher    = {{IEEE}},
  year         = {2016},
  url          = {https://doi.org/10.1109/3DIC.2016.7970002},
  doi          = {10.1109/3DIC.2016.7970002},
  timestamp    = {Thu, 14 Oct 2021 09:53:40 +0200},
  biburl       = {https://dblp.org/rec/conf/3dic/VosPPOMBKWWU16.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}