BibTeX record conf/3dic/SumitaTKTTT19

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@inproceedings{DBLP:conf/3dic/SumitaTKTTT19,
  author       = {Kei Sumita and
                  Jun Takeyasu and
                  Kimihiko Kato and
                  Kasidit Toprasertpong and
                  Mitsuru Takenaka and
                  Shinichi Takagi},
  title        = {Fabrication of High Quality InAs-on-Lnsulator Structures by Smart
                  Cut Process with Reuse of InAs Wafers},
  booktitle    = {2019 International 3D Systems Integration Conference (3DIC), Sendai,
                  Japan, October 8-10, 2019},
  pages        = {1--2},
  publisher    = {{IEEE}},
  year         = {2019},
  url          = {https://doi.org/10.1109/3DIC48104.2019.9058839},
  doi          = {10.1109/3DIC48104.2019.9058839},
  timestamp    = {Sun, 25 Jul 2021 11:44:52 +0200},
  biburl       = {https://dblp.org/rec/conf/3dic/SumitaTKTTT19.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}