BibTeX record conf/3dic/ShutoWIA11

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@inproceedings{DBLP:conf/3dic/ShutoWIA11,
  author       = {Takanori Shuto and
                  Naoya Watanabe and
                  Akihiro Ikeda and
                  Tanemasa Asano},
  editor       = {Mitsumasa Koyanagi and
                  Morihiro Kada},
  title        = {Low-temperature bonding of {LSI} chips to {PEN} film using Au cone
                  bump for heterogeneous integration},
  booktitle    = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
                  Osaka, Japan, January 31 - February 2, 2012},
  pages        = {1--4},
  publisher    = {{IEEE}},
  year         = {2011},
  url          = {https://doi.org/10.1109/3DIC.2012.6263012},
  doi          = {10.1109/3DIC.2012.6263012},
  timestamp    = {Wed, 16 Oct 2019 14:14:50 +0200},
  biburl       = {https://dblp.org/rec/conf/3dic/ShutoWIA11.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}