BibTeX record conf/3dic/ShenLHSKTMKF23

• > Home > conf/3dic/ShenLHSKTMKF23

@inproceedings{DBLP:conf/3dic/ShenLHSKTMKF23,
  author       = {Jiayi Shen and
                  Chang Liu and
                  Tadaaki Hoshi and
                  Atsushi Sinoda and
                  Hisashi Kino and
                  Tetsu Tanaka and
                  Mariappan Murugesan and
                  Mitsumasa Koyanagi and
                  Takafumi Fukushima},
  title        = {Impact of Super-long-throw {PVD} on {TSV} Metallization and Die-to-Wafer
                  3D Integration Based on Via-last},
  booktitle    = {{IEEE} International 3D Systems Integration Conference, 3DIC 2023,
                  Cork, Ireland, May 10-12, 2023},
  pages        = {1--4},
  publisher    = {{IEEE}},
  year         = {2023},
  url          = {https://doi.org/10.1109/3DIC57175.2023.10154930},
  doi          = {10.1109/3DIC57175.2023.10154930},
  timestamp    = {Mon, 10 Jul 2023 15:09:43 +0200},
  biburl       = {https://dblp.org/rec/conf/3dic/ShenLHSKTMKF23.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}