BibTeX record conf/3dic/ReedGGT10

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@inproceedings{DBLP:conf/3dic/ReedGGT10,
  author       = {Jason D. Reed and
                  Scott H. Goodwin and
                  Christopher Gregory and
                  Dorota Temple},
  title        = {Reliability testing of high aspect ratio through silicon vias fabricated
                  with atomic layer deposition barrier, seed layer and direct plating
                  and material properties characterization of electrografted insulator,
                  barrier and seed layer for 3-D integration},
  booktitle    = {{IEEE} International Conference on 3D System Integration, 3DIC 2010,
                  Munich, Germany, 16-18 November 2010},
  pages        = {1--8},
  publisher    = {{IEEE}},
  year         = {2010},
  url          = {https://doi.org/10.1109/3DIC.2010.5751434},
  doi          = {10.1109/3DIC.2010.5751434},
  timestamp    = {Wed, 16 Oct 2019 14:14:50 +0200},
  biburl       = {https://dblp.org/rec/conf/3dic/ReedGGT10.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}