BibTeX record conf/3dic/RajanKMB21

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@inproceedings{DBLP:conf/3dic/RajanKMB21,
  author       = {Sreejith Kochupurackal Rajan and
                  Ankit Kaul and
                  Gary S. May and
                  Muhannad S. Bakir},
  title        = {Electrical and Performance Benefits of Advanced Monolithic Cooling
                  for 2.5D Heterogeneous ICs},
  booktitle    = {{IEEE} International 3D Systems Integration Conference, 3DIC 2021,
                  Raleigh, NC, USA, October 26-29, 2021},
  pages        = {1--5},
  publisher    = {{IEEE}},
  year         = {2021},
  url          = {https://doi.org/10.1109/3DIC52383.2021.9687618},
  doi          = {10.1109/3DIC52383.2021.9687618},
  timestamp    = {Fri, 18 Feb 2022 10:36:41 +0100},
  biburl       = {https://dblp.org/rec/conf/3dic/RajanKMB21.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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