Recent Developments of Cu-Cu non-thermo compression bonding for wafer-to-wafer 3D stacking.

Ionut Radu Didier Landru Gweltaz Gaudin Gregory Riou Catherine Tempesta F. Letertre Léa Di Cioccio Pierric Gueguen Thomas Signamarcheix C. Euvrard Jérôme Dechamp Laurent Clavelier Mariam Sadaka Recent Developments of Cu-Cu non-thermo compression bonding for wafer-to-wafer 3D stacking. 1-6 2010 3DIC http://dx.doi.org/10.1109/3DIC.2010.5751454 conf/3dic/2010 db/conf/3dic/3dic2010.html#RaduLGRTLCGSEDCS10