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BibTeX record conf/3dic/PengLLMLKT10
@inproceedings{DBLP:conf/3dic/PengLLMLKT10, author = {Lan Peng and Hongyu Li and Dau Fatt Lim and Riko I. Made and Guo{-}Qiang Lo and Dim{-}Lee Kwong and Chuan Seng Tan}, title = {Fine-pitch bump-less Cu-Cu bonding for wafer-on-wafer stacking and its quality enhancement}, booktitle = {{IEEE} International Conference on 3D System Integration, 3DIC 2010, Munich, Germany, 16-18 November 2010}, pages = {1--5}, publisher = {{IEEE}}, year = {2010}, url = {https://doi.org/10.1109/3DIC.2010.5751429}, doi = {10.1109/3DIC.2010.5751429}, timestamp = {Thu, 14 Oct 2021 09:53:38 +0200}, biburl = {https://dblp.org/rec/conf/3dic/PengLLMLKT10.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
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