BibTeX record conf/3dic/PengLLMLKT10

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@inproceedings{DBLP:conf/3dic/PengLLMLKT10,
  author       = {Lan Peng and
                  Hongyu Li and
                  Dau Fatt Lim and
                  Riko I. Made and
                  Guo{-}Qiang Lo and
                  Dim{-}Lee Kwong and
                  Chuan Seng Tan},
  title        = {Fine-pitch bump-less Cu-Cu bonding for wafer-on-wafer stacking and
                  its quality enhancement},
  booktitle    = {{IEEE} International Conference on 3D System Integration, 3DIC 2010,
                  Munich, Germany, 16-18 November 2010},
  pages        = {1--5},
  publisher    = {{IEEE}},
  year         = {2010},
  url          = {https://doi.org/10.1109/3DIC.2010.5751429},
  doi          = {10.1109/3DIC.2010.5751429},
  timestamp    = {Thu, 14 Oct 2021 09:53:38 +0200},
  biburl       = {https://dblp.org/rec/conf/3dic/PengLLMLKT10.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}