BibTeX record conf/3dic/PanigrahiBGVS15

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@inproceedings{DBLP:conf/3dic/PanigrahiBGVS15,
  author       = {Asisa Kumar Panigrahi and
                  Satish Bonam and
                  Tamal Ghosh and
                  Siva Rama Krishna Vanjari and
                  Shiv Govind Singh},
  title        = {Long term efficacy of ultra-thin Ti passivation layer for achieving
                  low temperature, low pressure Cu-Cu Wafer-on-Wafer bonding},
  booktitle    = {2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai,
                  Japan, August 31 - September 2, 2015},
  pages        = {TS8.13.1--TS8.13.5},
  publisher    = {{IEEE}},
  year         = {2015},
  url          = {https://doi.org/10.1109/3DIC.2015.7334582},
  doi          = {10.1109/3DIC.2015.7334582},
  timestamp    = {Sun, 25 Oct 2020 22:39:05 +0100},
  biburl       = {https://dblp.org/rec/conf/3dic/PanigrahiBGVS15.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}