BibTeX record conf/3dic/NakamuraMKKMKSHKAUO13

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@inproceedings{DBLP:conf/3dic/NakamuraMKKMKSHKAUO13,
  author       = {Tadao Nakamura and
                  Yoriko Mizushima and
                  Hideki Kitada and
                  Young{-}Suk Kim and
                  Nobuhide Maeda and
                  Shoichi Kodama and
                  Ryuichi Sugie and
                  Hiroshi Hashimoto and
                  Akihito Kawai and
                  Kazuhisa Arai and
                  Akira Uedono and
                  Takayuki Ohba},
  title        = {Influence of wafer thinning process on backside damage in 3D integration},
  booktitle    = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
                  San Francisco, CA, USA, October 2-4, 2013},
  pages        = {1--6},
  publisher    = {{IEEE}},
  year         = {2013},
  url          = {https://doi.org/10.1109/3DIC.2013.6702400},
  doi          = {10.1109/3DIC.2013.6702400},
  timestamp    = {Sun, 25 Oct 2020 22:39:05 +0100},
  biburl       = {https://dblp.org/rec/conf/3dic/NakamuraMKKMKSHKAUO13.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}