BibTeX record conf/3dic/NagataTNUKCH19

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@inproceedings{DBLP:conf/3dic/NagataTNUKCH19,
  author       = {Takahiro Nagata and
                  Kazumichi Tsumura and
                  Kenro Nakamura and
                  Kengo Uchida and
                  Jin Kawakita and
                  Toyohiro Chikyow and
                  Kazuyuki Higashi},
  title        = {Photoelectroscopic Study of Mn Barrier Layer on SiO2 for Si Wafer
                  Bonding Process},
  booktitle    = {2019 International 3D Systems Integration Conference (3DIC), Sendai,
                  Japan, October 8-10, 2019},
  pages        = {1--4},
  publisher    = {{IEEE}},
  year         = {2019},
  url          = {https://doi.org/10.1109/3DIC48104.2019.9058775},
  doi          = {10.1109/3DIC48104.2019.9058775},
  timestamp    = {Sat, 30 Sep 2023 09:32:44 +0200},
  biburl       = {https://dblp.org/rec/conf/3dic/NagataTNUKCH19.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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